Helene Fremont,: search on Z-Library

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1

Intraarticular corticosteroids, supervised physiotherapy, or a combination of the two in the treatment of adhesive capsulitis of the shoulder: A placebo-controlled trial

Simon Carette, Hélène Moffet, Johanne Tardif, Louis Bessette, Frédéric Morin, Pierre Frémont, Vivian Bykerk, Carter Thorne, Mary Bell, William Bensen, Caty Blanchette

Journal:

Arthritis & Rheumatism

Year:

2003

Language:

english

File:

PDF, 106 KB

english, 2003

2

The Famished Roadby Ben Okri

Review by: Helen Fremont

Journal:

Year:

1992

Language:

english

File:

PDF, 549 KB

english, 1992

3

Fast reliability qualification of SiP products

Charles Regard, Christian Gautier, Hélène Fremont, Patrick Poirier, M.A. Xiaosong, Kaspar M.B. Jansen

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 463 KB

english, 2009

4

A new methodology for the identification of ball bond degradation during high-temperature aging tests on devices in standard plastic packages

Bahi Manoubi Auguste, Fremont Hélène, Landesman Jean-Pierre, Gentil Annabelle, Lecuyer Pascal

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 489 KB

english, 2009

5

Moisture diffusion in Printed Circuit Boards: Measurements and Finite- Element- Simulations

Kirsten Weide-Zaage, Walter Horaud, Hélène Frémont

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 596 KB

english, 2005

6

Dynamic void formation in a DD-copper-structure with different metallization geometry

Kirsten Weide-Zaage, David Dalleau, Yves Danto, Helene Fremont

Journal:

Microelectronics Reliability

Year:

2007

Language:

english

File:

PDF, 1.72 MB

english, 2007

7

Evaluation by three-point-bend and ball-on-ring tests of thinning process on silicon die strength

Samed Barnat, Hélène Frémont, Alexandrine Gracia, Eric Cadalen

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 823 KB

english, 2012

8

Who Killed Palomino Molero?by Mario Vargas Llosa; Alfred MacAdam

Review by: Helen Fremont

Journal:

Year:

1987

Language:

english

File:

PDF, 333 KB

english, 1987

9

The Universe, and Other Fictionsby Paul West

Review by: Helen Fremont

Journal:

Year:

1988

Language:

english

File:

PDF, 628 KB

english, 1988

10

Degradation Mechanisms of Au–Al Wire Bonds During Qualification Tests at High Temperature for Automotive Applications: Quality Improvement by Process Modification

Bahi, Manoubi Auguste, Lecuyer, Pascal, Gentil, Annabelle, Fremont, HÉlÈne, Landesman, Jean-Pierre, Christien, FrÉdÉric, Le Gall, RenÉ

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2008

Language:

english

File:

PDF, 568 KB

english, 2008

11

[IEEE 2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Bangalore, India (2007.07.11-2007.07.13)] 2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Influence of Technological Parameters on the Behavior during Aging at High Temperature of Various Packages, in the Automotive Environment

Auguste, Bahi Manoubi, Pascal, Lecuyer, Annabelle, Gentil, Helene, Fremont, Jean-Pierre, Landesman, Frederic, Christien, Rene, Le Gall

Year:

2007

Language:

english

File:

PDF, 5.30 MB

english, 2007

12

Qualification procedure for moisture in embedded capacitors

Frémont, Hélène, Kludt, Jörg, Wade, Massar, Weide-Zaage, Kirsten, Bord-Majek, Isabelle, Duchamp, Geneviève

Journal:

Microelectronics Reliability

Year:

2014

Language:

english

File:

PDF, 1.16 MB

english, 2014

13

[IEEE 2013 24th EAEEIE Annual Conference (EAEEIE 2013) - Chania, Greece (2013.05.30-2013.05.31)] 2013 24th EAEEIE Annual Conference (EAEEIE 2013) - A one week-lecture in the Euro-dots course program: Microelectronic assemblies: From packaging to reliability

Debeda, Helene, Favre, Isabelle, Gracia, Alexandrine, Labat, Nathalie, Plano, Bernard, Fremont, Helene

Year:

2013

Language:

english

File:

PDF, 685 KB

english, 2013

14

Assessment of Constitutive Properties of Solder Materials Used in Surface-Mount Devices for Harsh Environment Applications

Pocheron, Mickael, Deletage, Jean-Yves, Plano, Bernard, Guedon-Gracia, Alexandrine, Fremont, Helene

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2015

Language:

english

File:

PDF, 4.43 MB

english, 2015

15

[IEEE 2015 IEEE International Symposium on Electromagnetic Compatibility - EMC 2015 - Dresden, Germany (2015.8.16-2015.8.22)] 2015 IEEE International Symposium on Electromagnetic Compatibility (EMC) - How SI/EMC and reliability issues could interact together in embedded electronic systems?

Weide-Zaage, Kirsten, Moujbani, Aymen, Duchamp, Genevieve, Dubois, Tristan, Verdier, Frederic, Fremont, Helene

Year:

2015

Language:

english

File:

PDF, 1.21 MB

english, 2015

16

Admitting the Holocaust: Collected Essaysby Lawrence L. Langer;Art from the Ashes: A Holocaust Anthologyby Lawrence L. Langer

Review by: Helen Fremont

Journal:

Year:

1995

Language:

english

File:

PDF, 386 KB

english, 1995

17

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Smart Packaging - Microscopic Temperature and Moisture Sensors Embedded in a Flip-Chip Package

Quelennec, Aurore, Ayadi, Yosri, Vandier, Quentin, Duchesne, Eric, Fremont, Helene, Drouin, Dominique

Year:

2018

File:

PDF, 340 KB

2018

18

[IEEE 2017 27th EAEEIE Annual Conference (EAEEIE) - Grenoble, France (2017.6.7-2017.6.9)] 2017 27th EAEEIE Annual Conference (EAEEIE) - The SALEIE Project : A successful International Collaborative Project and springboard for future projects

Ward, Anthony, Grout, Ian, Fremont, Helene, Cojocaru, Dorian, Poboroniuc, Marian, Lhotska, Lenka, Welzer, Tatjana, Grindei, Laura

Year:

2017

File:

PDF, 5.77 MB

2017

19

Faculty evaluation in Departments of Family Medicine: do our universities measure up?

Michael E Green, Connie L Ellis, Pierre Frémont, Helen Batty

Journal:

Medical Education

Year:

1998

Language:

english

File:

PDF, 84 KB

english, 1998

20

Synthesis and Characterization of Palladium(II) and Nickel(II) Alcoholate-Functionalized NHC Complexes and of Mixed Nickel(II)–Lithium(I) Complexes

Hameury, Sophie, de Frémont, Pierre, Breuil, Pierre-Alain R., Olivier-Bourbigou, Hélène, Braunstein, Pierre

Journal:

Inorganic Chemistry

Year:

2014

Language:

english

File:

PDF, 2.16 MB

english, 2014

21

Dusk and Other Storiesby James Salter

Review by: Helen Fremont

Journal:

Year:

1988

Language:

english

File:

PDF, 329 KB

english, 1988

22

Light Year '87by Robert Wallace

Review by: Helen Fremont

Journal:

Year:

1988

Language:

english

File:

PDF, 538 KB

english, 1988

23

The Templeby Stephen Spender

Review by: Helen Fremont

Journal:

Year:

1988

Language:

english

File:

PDF, 587 KB

english, 1988

24

Synthesis and characterization of oxygen-functionalised-NHC silver(i) complexes and NHC transmetallation to nickel(ii)

Hameury, Sophie, de Frémont, Pierre, R. Breuil, Pierre-Alain, Olivier-Bourbigou, Hélène, Braunstein, Pierre

Journal:

Dalton Transactions

Year:

2014

Language:

english

File:

PDF, 1.81 MB

english, 2014

25

[IEEE Multi-Physics simulation and Experiments in Microelectronics - Freiburg im Breisgau, Germany (2008.04.20-2008.04.23)] EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems - Solder fatigue of Wafer Level package assemblies. Comparison with flip chip BGA’S

Regard, Charles, Gautier, Christian, Fremont, Helene, Val, Alexandre, Roullier, Frederic, Schwindenhammer, Patrice, Poirier, Patrick

Year:

2008

Language:

english

File:

PDF, 520 KB

english, 2008

26

Bis(ether-functionalized NHC) Nickel(II) Complexes, Trans to Cis Isomerization Triggered by Water Coordination, and Catalytic Ethylene Oligomerization

Hameury, Sophie, de Frémont, Pierre, Breuil, Pierre-Alain R., Olivier-Bourbigou, Hélène, Braunstein, Pierre

Journal:

Organometallics

Year:

2015

Language:

english

File:

PDF, 2.32 MB

english, 2015

27

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Moisture diffusion model verification of packaging materials

Xiaosong Ma,, Jansen, K.M.B., Ernst, L.J., van Driel, W.D., van der Sluis, O., Zhang, G.Q., Regard, Charles, Gautier, Christian, Fremont, Helene

Year:

2008

Language:

english

File:

PDF, 370 KB

english, 2008

28

[IEEE Multi-Physics simulation and Experiments in Microelectronics - Freiburg im Breisgau, Germany (2008.04.20-2008.04.23)] EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems - Study of JEDEC B-condition JESD22-B111 standard for drop test reliability of Chip Scale Packages

Bentata, Yassine, Forster, Stephane, Kim Yong Goh,, Fremont, Helene

Year:

2008

Language:

english

File:

PDF, 959 KB

english, 2008

29

[IEEE Multi-Physics simulation and Experiments in Microelectronics - Freiburg im Breisgau, Germany (2008.04.20-2008.04.23)] EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems - Effect of aging of packaging materials on die surface cracking of a SiP carrier

Xiaosong Ma,, Jansen, K. M. B., Ernst, L. J., van Driel, W. D, van der Sluis, O., Zhang, G. Q., Regard, Charles, Gautier, Christian, Fremont, Helene

Year:

2008

Language:

english

File:

PDF, 307 KB

english, 2008

30

[IEEE 2009 10th International Conferene on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Delft, The Netherlands (2009.04.26-2009.04.29)] EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Virtual prototyping of a Wafer Level Chip Scale Package: Underfill role in die cracking

Barnat, Samed, Bellenger, Stephane, Fremont, Helene, Gracia, Alexandrine, Talbot, Pascal

Year:

2009

Language:

english

File:

PDF, 9.65 MB

english, 2009

31

[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Fast qualification using thermal shock combined with moisture absorption

Ma, Xiaosong, Zhang, G. Q., Jansen, K. M. B., van Driel, W. D, van der Sluis, O., Ernst, L. J., Regard, Charles, Gautier, Christian, Fremont, Helene

Year:

2009

Language:

english

File:

PDF, 1.20 MB

english, 2009

32

[IEEE Multi-Physics simulation and Experiments in Microelectronics - Freiburg im Breisgau, Germany (2008.04.20-2008.04.23)] EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems - Simulation of migration effects in PoP

Weide-Zaage, Kirsten, Helene Fremont,, Linyan Wang,

Year:

2008

Language:

english

File:

PDF, 807 KB

english, 2008

33

[IEEE 2012 11th International Conference on Information Technology Based Higher Education and Training (ITHET) - Istanbul, Turkey (2012.06.21-2012.06.23)] 2012 International Conference on Information Technology Based Higher Education and Training (ITHET) - PhD in Electrical and Information Engineering in Europe: Towards a harmonization including LifeLong Learning

Bonnaud, Olivier, Fremont, Helene, Thiriet, Jean-Marc, Yahoui, Hamed

Year:

2012

Language:

english

File:

PDF, 968 KB

english, 2012

34

[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Bond Reliability Improvement at High Temperature by Pd Addition on Au Bonding Wires

Bahi, Manoubi Auguste, Lecuyer, Pascal, Gentil, Annabelle, Fremont, Helene, Landesman, Jean-Pierre, Christien, Frederic

Year:

2008

Language:

english

File:

PDF, 6.69 MB

english, 2008

35

[IEEE 2012 11th International Conference on Information Technology Based Higher Education and Training (ITHET) - Istanbul, Turkey (2012.06.21-2012.06.23)] 2012 International Conference on Information Technology Based Higher Education and Training (ITHET) - International dimension to increase Lifelong Learning possibilities in Europe

Thiriet, Jean-Marc, Yahoui, Hamed, Fremont, Helene

Year:

2012

Language:

english

File:

PDF, 527 KB

english, 2012

36

Effect of carbonic anhydrase III inhibition on substrate utilization and fatigue in rat soleus

Côté, Claude, Riverin, Hélène, Barras, Marie-Josée, Tremblay, Roland R., Frémont, Pierre, Frenette, Jérôme

Journal:

Canadian Journal of Physiology and Pharmacology

Year:

1993

Language:

english

File:

PDF, 992 KB

english, 1993

37

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Influence of underfill methods on the solder joint fatigue of wafer level packaging

Regard, Charles, Gautier, Christian, Fremont, Helene, Poirier, Patrick

Year:

2008

Language:

english

File:

PDF, 1.47 MB

english, 2008

38

[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Bordeaux, France (2010.04.26-2010.04.28)] 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) - Die attach interface property characterization as function of temperature using cohesive zone modeling method

Xiaosong Ma,, Zhang, G.Q., van der Sluis, O., Jansen, K.M.B., van Driel, W.D, Ernst, L.J., Regard, Charles, Gautier, Christian, Fremont, Helene

Year:

2010

Language:

english

File:

PDF, 23.56 MB

english, 2010

39

[IEEE 2010 9th International Conference on Information Technology Based Higher Education and Training (ITHET) - Cappadocia, Turkey (2010.04.29-2010.05.1)] 2010 9th International Conference on Information Technology Based Higher Education and Training (ITHET) - Field return on a Chinese-French double graduation of an international master in electronics and telecommunications on the base of the Bologna process

Bonnaud, Olivier, Senhadji, Lotfi, Wei, Lei, Luo, Limin, Fremont, Helene, Shu, Huazhong

Year:

2010

Language:

english

File:

PDF, 315 KB

english, 2010

40

[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Bordeaux, France (2010.04.26-2010.04.28)] 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) - Design for reliability: Thermo-mechanical analyses of stress in Through Silicon Via

Barnat, Samed, Fremont, Helene, Gracia, Alexandrine, Cadalen, Eric, Bunel, Catherine, Neuilly, Francois, Tenailleau, Jean-Rene

Year:

2010

Language:

english

File:

PDF, 9.71 MB

english, 2010

41

[IEEE 2013 24th EAEEIE Annual Conference (EAEEIE 2013) - Chania, Greece (2013.05.30-2013.05.31)] 2013 24th EAEEIE Annual Conference (EAEEIE 2013) - Criteria of the EIE courses accessible to disabled students. Legibility of cursus and experiences sharing for generalizing good practices

Demontoux, Francois, Fremont, Helene, Woirgard, Eric

Year:

2013

Language:

english

File:

PDF, 158 KB

english, 2013

42

[IEEE 2008 19th EAEEIE Annual Conference - Tallinn (2008.06.29-2008.07.2)] 2008 19th EAEEIE Annual Conference - Development of an HMI based on the OPC standard

Bouter, Serge, Malti, Rachid, Fremont, Helene

Year:

2008

Language:

english

File:

PDF, 354 KB

english, 2008

43

[IEEE 2009 10th International Conferene on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Delft, The Netherlands (2009.04.26-2009.04.29)] EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Package delamination as indicator of ball bond lift: New diagnostic methodology

Bahi, Manoubi Auguste, Lecuyer, Pascal, Gentil, Annabelle, Fremont, Helene, Landesman, Jean-Pierre

Year:

2009

Language:

english

File:

PDF, 838 KB

english, 2009

44

SPIE Proceedings [SPIE Microelectronic Manufacturing 1996 - Austin, TX (Wednesday 16 October 1996)] Microelectronic Manufacturing Yield, Reliability, and Failure Analysis II - Time reduction of MCM-D prototype realization by process control and modeling

Fremont, Helene, Ahrens, C., Saint Christophe, E., Enoeckl, B., Fathi, M., N'kaoua, G., Pellet, C., Ferretti, Ruediger, Danto, Yves, Keshavarzi, Ali, Prasad, Sharad, Hartmann, Hans-Dieter

Year:

1996

Language:

english

File:

PDF, 869 KB

english, 1996

45

Silver(I) and copper(I) complexes with bis-NHC ligands: Dinuclear complexes, cubanes and coordination polymers

Charra, Valentine, de Frémont, Pierre, Breuil, Pierre-Alain R., Olivier-Bourbigou, Hélène, Braunstein, Pierre

Journal:

Journal of Organometallic Chemistry

Year:

2015

Language:

english

File:

PDF, 871 KB

english, 2015

46

Virtual prototyping in a Design-for-Reliability approach

Barnat, Samed, Guédon-Gracia, Alexandrine, Frémont, Hélène

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 1.88 MB

english, 2015

47

Lipstick

Journal:

Year:

1995

Language:

english

File:

PDF, 236 KB

english, 1995

48

The Writing Life: The Hopwood Lecturesby Nicholas Delbanco;The Lost Suitcaseby Nicholas Delbanco;What Remainsby Nicholas Delbanco

Review by: Helen Fremont

Journal:

Year:

2001

Language:

english

File:

PDF, 647 KB

english, 2001

49

Editorial

Bafleur, Marise, Perdu, Philippe, Marc, François, Fremont, Hélène, Nolhier, Nicolas

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 153 KB

english, 2015

50

Accident/ A Day's Newsby Christa Wolf; Heike Schwarzbauer; Rick Takvorian

Review by: Helen Fremont

Journal:

Harvard Book Review

Year:

1990

Language:

english

File:

PDF, 632 KB

english, 1990